Industry News

Printable, flexible and hybrid electronics sector

Airbus, Royole exploring FHE aircraft applications

Dec. 16, Xinhua: The Airbus China Innovation Centre (ACIC) and flexible electronics manufacturer Royole Corp. will begin to explore applications for flexible and hybrid electronics (FHE) in aircraft. According to a strategic Memorandum of Understanding between the two...

read more

Varitron acquires XCELSIA Technologies

Dec. 4, EP&T: Varitron has acquired Mirabel, QC-based XCELSIA Technologies, a manufacturing services provider specializing in electronic circuit assembly. Varitron will absorb XCELSIA’s 15 employees along with its Mirabel facility, which will be dedicated to...

read more

apmaTEC calls for autonomous tech proposals for autos

The apmaTEC, an initiative led by the Automotive Parts Manufacturers Association (APMA) and the Autonomous Vehicle Innovation Network (AVIN), is seeking technology proposals from Ontario SMEs as it equips a fleet of connected and autonomous vehicles. Application...

read more

Nano Dimension looking to expand with $28.8M Nasdaq offering

Nov. 22, 3D Printing Industry.com: Nano Dimension is looking to raise nearly $30M in funding, after the Israeli 3D printing company said in an SEC filing it would raise the money "to expedite our growth and to further advance our breakthrough technologies and...

read more

Powering FHE: The case for thin, printed, flexible batteries

October 31, Printed Electronics World: As FHE and related technologies become more mainstream, the need to power flexible electronics with thin, printed, and flexible batteries that last longer has become more and more important. Battery technology has long been a...

read more

C2MI to add stealth dicing to its capabilities

Sept. 8, EPT.ca: C2MI, a center of excellence for advanced packaging and microsystems in Bromont, Que., will add new equipment to allow for stealth dicing, a laser-based technique for cutting up silicon wafers, after acquiring a fully automatic DFL 7340 laser saw from...

read more

Brewer Science announces RDL-first fan-out packaging material

Sept. 3, Solid State Technology: Brewer Science recently announced its latest products, which includes additions to the BrewerBOND group of temporary bonding materials and the first iteration of its BrewerBUILD line of thin spin-on packaging materials. The company's...

read more

Members Only Portal

Members receive access to exclusive content, member directory, forums, job postings, and special events.

New 1-day courses in printable, flexible, hybrid electronics

Geared toward potential technology users and developers who wish to learn more about what is possible with printable, flexible or wearable electronics and how to integrate into products for a range of industries.

Get Smart Summit, Mississauga

October 17, 2017
Inaugural intelliPACK event to mobilize industry to accelerate the development and broad adoption of smart packaging innovations.