intelliFLEX Board of Directors

Building a stronger alliance

Paul Smith

Paul Smith

Chairman of the Board

Vice President, Xerox Research Centre of Canada, (Chair)

Paul joined Xerox in 1995 and currently leads Xerox Corporation Global Materials Research Centre (XRCC), which is responsible for Xerox advanced materials research and development. The research centre also conducts research and development in support of commercial clients in the areas of advanced and specialty materials. He is a named inventor on 73 U.S. patents and has 16 publications.

Peter Kallai

Peter Kallai

President and CEO

Peter Kallai was the Founding Executive Director of the Canadian Printable Electronics Industry Association (CPEIA) -- the forerunner of intelliFLEX. He is also the President and CEO of KEYSTEP Growth & Finance. This Ottawa-based boutique consulting firm has focused on emerging technologies for 20 years. As a senior high-tech management consultant, Peter has assisted leading companies in optical and wireless communications, software and earth observation with their growth plans and financing. He has been involved with the inception, growth, exit and merger or acquisition of more than 40 companies. In the role of Vice-President, he helped a TSX-listed company grow from $3.2 million to over $100 million in revenue. Peter has also served on various boards and committees of companies and public sector R&D organizations. He holds a Bachelor of Commerce Degree and a Masters in Business Administration Degree (MBA) in Strategy and Finance. Peter is also a certified Project Management Professional (PMP) with the Project Management Institute (US).

Howard Campbell

Howard Campbell

Business Development, Memtronik Innovations

Howard Campbell is a Sales professional with over 30 years of sales, management and consulting experience. His high technology sector focus has been on semiconductors and printed electronics. Howard led teams in Canada and Internationally, where language skills have served him well. His role at Memtronik Innovations involves building business for new printed electronics solutions that ongoing investments by Memtronik in technology enable. He has worked with organizations like Cisco, Drexelbrook Engineering, DuPont, Environment Canada, inBay Technologies, Lattice Semiconductor, NTK Semiconductor and STMicroelectronics. Howard is a graduate of the University of Ottawa and Queen's University and is based in Ottawa.

Christine Di Fabio

Christine Di Fabio

Print & Connectivity Global Capability, Unilever R&D, Unilever

Christine started as an intern with Lever Brothers in Canada in 1995 and since then has worked in various roles within R&D Packaging, including local and global positions across multiple categories. In her current Print & Connectivity role, Christine is responsible for developing capabilities through innovation and technology partnerships that can be applied globally across all categories and customer channels. This role focuses on identifying and delivering new innovations and technologies that add value to customers and consumers, to store and in store.

Christine Jones Harris

Christine Jones Harris

Co-owner and Principal, Corporate Development, Jones Packaging Inc.

Chris leads innovation development and commercialization, strategic partner relationships and investments, marketing and communications, and HR at Jones Packaging. In 1996, Chris and her husband, Ron, led the successful buyout of the business from the remaining family members. The company now employs 370 people across its facilities in London, as well as more recently acquired businesses in Toronto, the United Kingdom and Spain. Chris serves on the Advisory Board of the Lawrence Kinlin School of Business at Fanshawe College, the Huron University College Foundation Board, and the Children’s Health Foundation Board.

Past Members

Robin Jeffries

Robin Jeffries

President, Tangio Printed Electronics

Robin Jeffries has vast knowledge of printable electronics, including design, prototype conception and commercializing various products and production methods over the past 34 years. He is President of Sytek Enterprises and the company’s printed electronics division, Tangio. He drives new strategic initiatives in electronic printing methods and product development creating new opportunities worldwide. 

Dr. Michael Tischler

Dr. Michael Tischler

Chief Technology Officer, Cooledge Lighting

Dr. Tischler has been involved in intellectual property, both in invention and prosecution, throughout his career and is a named inventor on over 70 patents. He is an editor for the Journal of Crystal Growth and the Journal of Electronic Materials. Cooledge Lighting develops innovative broad-area lighting based on large arrays of small, low power light-emitting diodes on a thin flexible plastic sheet. Cooledge incorporates a number of aspects from RFID and printable electronics into its approach to high-quality lighting.

Member Portal

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Test drive our new 1-day course in printable, flexible, hybrid electronics, Toronto

September 28, 2017
Geared toward potential technology users and developers who wish to learn more about what is possible with printable, flexible or wearable electronics and how to integrate into products for a range of industries.

Register Now

Get Smart Summit, Mississauga

October 17, 2017
Inaugural intelliPACK event to mobilize industry to accelerate the development and broad adoption of smart packaging innovations.

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About Us

intelliFLEX, a not-for-profit industry alliance, is a vital partner for accelerating the growth of the printable, flexible and hybrid electronics sector of more than 300 organizations across Canada. Our technologies add intelligence and connect ordinary objects to enable the Internet of Everything.

We unite our growing global membership to build an effective ecosystem of supply chains for flexible, 3D printable electronics, 2D large area printable electronics, wearable electronics, smart textiles and hybrid electronics including related semiconductors, integrated circuits and software.

Our programs accelerate the adoption of these innovations for Smart Packaging and Retail, Intelligent Buildings and Connected Homes, Aerospace and Defence, Automotive and Industrial Applications, Health and Wellness, Intelligent Documents and Wearables.

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