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NGEN Supercluster Project Pitch Day

April 16

Next Generation Manufacturing Canada (NGEN) invites interested companies to its first Supercluster Project Pitch Day, April 16th 2019.

NOTE: NGen Canada has moved its April 16 Advanced Manufacturing Supercluster “Pitch A Project” day to Lot42 in Kitchener to accommodate demand for places. The event provides organizations and individuals a stage to pitch ambitious ideas for Supercluster funding, or to make their interest known in joining a project consortium.

You can register for the event here.

Companies with Supercluster project ideas and in need of partners will deliver short presentations, then be available afterward to discuss their plans. NGen welcomes any company with a potential Supercluster project they wish to pitch to contact us at ideas@ngen.ca.

The Advanced Manufacturing Supercluster administers $190 million in federal funding for industry-led, collaborative projects. Information about whether your project meets NGen’s eligibility and other project requirements can be found at members.ngen.ca.

Details and registration information for the April 16 Kitchener-Waterloo event can be found at https://www.ngen.ca/pitch.

Participation is limited so please register early. This is a must-attend gathering, whether you’re interested in Supercluster projects or simply want to connect with other leaders in Canadian advanced manufacturing. Everyone will have an opportunity to network and meet prospective partners throughout the day.

We look forward to seeing you on April 16th!

Venue

Lot42
41 Ardelt Pl.
Kitchener, Ontario N2C 2C8 Canada
+ Google Map
Website:
https://lot42.ca/

About Us

intelliFLEX, a not-for-profit industry alliance, is a vital partner for accelerating the growth of the printable, flexible and hybrid electronics sector of more than 300 organizations across Canada. Our technologies add intelligence and connect ordinary objects to enable the Internet of Everything.

We unite our growing global membership to build an effective ecosystem of supply chains for flexible, 3D printable electronics, 2D large area printable electronics, wearable electronics, smart textiles and hybrid electronics including related semiconductors, integrated circuits and software.

Our programs accelerate the adoption of these innovations for Smart Packaging and Retail, Intelligent Buildings and Connected Homes, Aerospace and Defence, Automotive and Industrial Applications, Health and Wellness, Intelligent Documents and Wearables.

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