CPES2019, Canada’s premier conference and trade show exhibition for flexible and hybrid electronics (FHE), is now open for registration along with speaker, academic poster and exhibitor submissions.

Organized by the intelliFLEX InnovationAlliance, CPES2019 takes place from May 16-17 at the Domaine Chateau-Bromont in Bromont, Quebec, less than an hour from Montreal.

The deadline for academic poster and speaker submissions is Feb. 18. The submission deadline for our Innovation Awards is March 22.

Register now for our Early Bird pricing: Save up to $100 off the regular admission until March 31.

CPES has grown into an internationally recognized event, having hosted past delegations from the U.S., Taiwan, France and Greece. With over 40 speakers, four workshops, four industry awards, 22 industry exhibitors and 15 academic posters, last year’s event was a huge success (check out the event video). 

And don’t wait to book your tabletop exhibit space – we book up early every year!

What’s CPES2019 all about?

Flexible and hybrid electronics (FHE) enable hundreds of new applications in various verticals by adding intelligence to ordinary objects with unique form factors. FHE uses next-generation additive and manufacturing electronics technologies that can help all 2,000 electronics players in Canada. The broader FHE market represents a $31.6B global market opportunity.

This is a growth opportunity for all electronics players, including the semiconductor industry, as they hit the limits of Moore’s Law for integrated circuits – they’re looking for new ways to produce electronics components more efficiently for existing and new applications.

What’s new at CPES2019?

This year’s event will also host tours and demonstrations to celebrate the opening of C2MI’s new Advanced Manufacturing Centre for scale-up manufacturing. Bromont’s Scientific Park is the home of Canada’s microelectronics industry with world renowned companies such as Teledyne DALSA Semiconductor Inc., IBM Canada Ltd., and Varitron, to name just a few, combined with Canada’s largest microsystems R&D Center, C2MI – making the area a unique integrated value chain.

At CPES2019, industry-leading Canadian and international speakers will explore all facets of FHE during the fifth annual CPES including flexible, stretchable, and 2D/3D printable electronics; smart textiles and wearables; and flex-integrated circuit technologies, software and applications. 

CPES allows existing companies to build their capabilities and supply chains as well as companies new to FHE to come up to speed very quickly on this new opportunity. The conference will bring together more than 120 members of C2MI and 125 members of intelliFLEX, uniting members of the Canadian semiconductor and flexible hybrid electronics industries and leading the way to emerging new technological possibilities and markets.

Submissions are welcome in …

CPES2019 will cover the broad spectrum of flexible and hybrid electronics (FHE) and the value chain required to bring innovative products and applications to market. We explore technologies, opportunities and industry challenges through tabletop exhibits and academic posters, our Innovation Awards, presentations, an investor panel and industry panel discussions.

About Us

intelliFLEX, a not-for-profit industry alliance, is a vital partner for accelerating the growth of the printable, flexible and hybrid electronics sector of more than 300 organizations across Canada. Our technologies add intelligence and connect ordinary objects to enable the Internet of Everything.

We unite our growing global membership to build an effective ecosystem of supply chains for flexible, 3D printable electronics, 2D large area printable electronics, wearable electronics, smart textiles and hybrid electronics including related semiconductors, integrated circuits and software.

Our programs accelerate the adoption of these innovations for Smart Packaging and Retail, Intelligent Buildings and Connected Homes, Aerospace and Defence, Automotive and Industrial Applications, Health and Wellness, Intelligent Documents and Wearables.

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