May 16-17, 2019 | Domaine Chateau Bromont | Québec

Explore all facets of flexible and hybrid electronics (FHE), including flexible, 2D and 3D printable, wearable, stretchable, smart textiles and flex-integrated circuit technologies, software and applications at CPES2019.

This year’s event will be held at the Domaine Chateau-Bromont hotel in the beautiful Eastern Townships area of Quebec. CPES2019 will provide valuable networking, technical updates, and ecosystem updates needed to commercialize FHE in IoT devices and other products.

From wearables to artificial intelligence: Printed electronics is a key technology

Flexible, printable and hybrid electronics (FHE) enable hundreds of new applications in various verticals by adding intelligence to ordinary objects with unique form factors. FHE uses next-generation additive and manufacturing electronics technologies that can help all 2,000 electronics players in Canada, as these technologies can augment and improve ordinary objects including smart parts, wearable devices, smart building surfaces, new sensor technologies for cars, smart consumer products, retail displays and smart packaging. The possibilities are endless, and represent a $31.6B global market opportunity, according to IDTECHEX.

With the past three events taking place in Toronto, ON, CPES in 2019 will land in Bromont, Quebec – hotbed of the Canadian semiconductor industry, where significant investment in FHE is ongoing.

At CPES, industry leading Canadian and international speakers will explore all facets of FHE during the fifth annual CPES including flexible, stretchable, and 2D/3D printable electronics; smart textiles and wearables; and flex-integrated circuit technologies, software and applications.

Highlights from CPES2018

CPES2019 Sponsors and Partners

May 16-17, 2019 | Domaine Chateau Bromont | Québec