Organized by the intelliFLEX Innovation Alliance, CPES2019 takes place May 16-17 at Domaine Chateau-Bromont in Bromont, Quebec.
Come learn about end users and their needs at CPES2019, the place where industry and academia meet to do business and find opportunity. Why pay more at the door? Register today for the best available pricing – Early Bird pricing ends on March 31.
Here are the latest additions to our speaker lineup. Stay tuned for more speaker announcements!
Alroy Almeida, CEO, Voltera
Almeida is CEO and co-founder of Voltera, a Canadian business working to bring rapid electronics fabrication to businesses and institutions around the world. Voltera focuses on early stages in the product development cycle as well as novel electronics applications. He will discuss the missing link in the printed electronics industry.
Ghada Badawy, Professor, McMaster University
Badawy is a Principal Research Engineer at the Computing Infrastructure Research Center (CIRC). She leads projects in resource allocation, capacity optimization, load balancing, network as a large system, energy-related issues and cross-layer design in wireless networks, wireless mesh, vehicular and sensor networks. She will speak about the ways in which we can identify and embrace disruptive innovation.
Chloé Bois, R&D Manager, Institut des communications graphiques et de l’imprimabilité (ICI)
Bois is R&D manager at ICI, where she specializes in advanced manufacturing, printed electronics applications, prototyping and developing methods to industrialize printed products manufactured by hybrid technologies such as graphic printing, printed electronics, and embedded standard electronics. Bois will speak about updates to flex roadmaps.
Justine Decaens, Project Leader, CTT Group
Decaens is a skilled engineering manager leveraging a strong technical background in R&D, quality control and laboratory testing. She works on R&D projects in technical textiles, smart textiles, advanced materials and protective clothing. She will speak about wearable tech and smart textiles as a platform for women’s leadership.
Ali Dehghantanha, Director, Cyber Science Lab, University of Guelph
Dehghantanha is the director of Cyber Science Lab in the School of Computer Science, University of Guelph (UofG), Ontario, Canada. He will speak about the use of machine learning to protect the industrial Internet of Things from cyberattacks.
Colin Singh Dhillon, CTO, APMA
Dhillon is the Chief Technical Officer (CTO) at Canada’s Automotive Parts Manufacturer’s Association (APMA). He oversees the Autonomous Vehicle Innovation Network (AVIN) Demonstration Zone and provides support to the Canadian automotive industry on matters of Advanced Vehicle and Industry Technology. He will speak about V2X opportunities.
Denis Faubert, President & CEO, CARIC/CRIAQ
Faubert, who earned his Ph.D. in Laser Physics from Université Laval, is the President and CEO of both the Consortium for Aerospace Research and Innovation in Canada (CARIC) and the Consortium for Research and Innovation in Aerospace in Quebec (CRIAQ). Previously, he was the General Manager of the Hydro-Quebec Research Institute (IREQ). Faubert will speak about aerospace defence.
Mario LeClerc, Canada Research Chair, Universite Laval
LeClerc is the Canada Research Chair on Electroactive and Photoactive Polymers at Laval’s Centre de Recherche en Sciences et Ingénierie des Macromolécules (CERSIM). He is also head of NSERC’s GreEN Electronics Network. He will speak about the current state and future potential of green electronics.
James Lee, Director of Technology, Jones Packaging
Since 2013, Lee has held the position of Director, Technology and Innovation at Jones Packaging, focusing on innovative packaging manufacturing and design technologies for tomorrow. He will speak about smart packaging and the availability of track and trace technologies.
William Wong, Professor, University of Waterloo
Wong is a Professor at the University of Waterloo in the Department of Electrical and Computer Engineering. His research focus is directed toward the development of thin film devices and novel nanocomposite materials for applications in high performance flexible electronics, solid state lighting, image sensors, and energy storage. He will speak about flexible electronics through heterogeneous integration of thin film and nanoscale materials.
For more information about CPES2019, please contact intelliFLEX CEO Mark Majewski @ email@example.com.