Vahid Akhavan, NovaCentrix
Global Applications Engineering Lead
Akhavan is Global Applications Engineering Lead at NovaCentrix, based in Austin, Texas. He received his Ph.D. in Chemical Engineering from the University of Texas at Austin, and his research focuses strongly on colloidal synthesis, inorganic chemistry, and electronic device fabrication. Dr. Akhavan has over 17 peer reviewed publications, one patent application, and has presented at numerous technical seminars and workshops.
Alroy Almeida, Voltera
Almeida is CEO and co-founder of Voltera, a Canadian business working to bring rapid electronics fab to businesses and institutions around the world. Voltera focuses on early stages in the product development cycle as well as novel electronics applications. He will discuss the missing link in the printed electronics industry, along with insights on how to expand the adoption of printed electronics globally.
Ghada Badawy, McMaster University
Principal Research Engineer
Badawy is a Principal Research Engineer at the Computing Infrastructure Research Center (CIRC). She leads projects in resource allocation, capacity optimization, load balancing, network as a large system, energy-related issues and cross-layer design in wireless networks, wireless mesh, vehicular and sensor networks. She will speak about the ways in which we can identify and embrace disruptive innovation. She will discuss questions such as:
What is disruptive innovation? What are some examples of disruptive innovations? Are all innovations disruptive? And how should current businesses prepare for disruption in their markets?
Chloé Bois, Insitut des communications graphiques et le imprimabilité (ICI)
Bois is R&D manager at ICI, where she specializes in advanced manufacturing, printed electronics applications, prototyping and developing methods to industrialize printed products manufactured by hybrid technologies such as graphic printing, printed electronics and embedded standard electronics. Bois will speak about updates to flexible road maps.
Jay Fallah, NXM Labs
Fallah is a veteran technologist with extensive experience in developing innovative, leading edge software and hardware systems. He oversees all aspects of NXM’s Autonomous Security platform development and advance research initiatives. He will discuss self-initializing IoT and blockchain security.
Justine Decaens, Groupe CTT Group
Decaens is a skilled engineering manager leveraging a strong technical background in R&D, quality control and laboratory testing. She works on R&D projects in technical textiles, smart textiles, advanced materials and protective clothing. She will speak about wearable tech and smart textiles as a platform for women’s leadership, especially compared to the traditional textiles industry, and how smart textiles can be a platform to merge traditional skills with new technologies and encourage women to get acquainted with such technologies.
Ali Dehghantanha, University of Guelph
Director, Cyber Science Lab
Dehghantanha is the director of Cyber Science Lab in the School of Computer Science, University of Guelph (UofG), Ontario, Canada. He will speak about the use of machine learning to protect the industrial Internet of Things from cyberattacks: While the IoT is already changing all aspects of our life, it mostly contains black boxes where customers have little to no insight about how IoT devices work or what they are capable of. This presentation offers a framework along with a technology stack to make a trustable IoT environment.
Colin Singh Dhillon, APMA
Dhillon is the Chief Technical Officer (CTO) at Canada’s Automotive Parts Manufacturer’s Association (APMA). He oversees the Autonomous Vehicle Innovation Network (AVIN) Demonstration Zone and provides support to the Canadian automotive industry on matters of Advanced Vehicle and Industry Technology. He will speak about 5G and C-V2X as the next chapter on the wireless communication front for automobiles. Which language will vehicles speak when they talk to one another? The connected vehicle is now capable of communicating with so much of its surroundings, the industry has labeled it as V2X (vehicle to everything).
Denis Faubert, CARIC/CRIAQ
President & CEO
Faubert, who earned his Ph.D. in Laser Physics from Université Laval, is the President and CEO of both the Consortium for Aerospace Research and Innovation in Canada (CARIC) and the Consortium for Research and Innovation in Aerospace in Quebec (CRIAQ). Previously, he was the General Manager of the Hydro-Quebec Research Institute (IREQ). Faubert will speak about aerospace defence.
Mario LeClerc, Université Laval/NSERC GreEN Network
Canada Research Chair
LeClerc is the Canada Research Chair on Electroactive and Photoactive Polymers at Laval’s Centre de Recherche en Sciences et Ingénierie des Macromolécules (CERSIM). He is also head of NSERC’s GreEN Electronics Network. He will speak about the current state and future potential of green electronics: the high throughput and low-cost manufacturing capabilities of printed electronics are ideally suited to the mass production of devices needed for the Internet of Things and smart packaging. But the potential scale of this mass production also presents an environmental challenge that must be addressed for PE manufacturing to be a viable approach.
James Lee, Jones Packaging
Since 2013, Lee has held the position of Director, Technology and Innovation at Jones Packaging, focusing on innovative packaging manufacturing and design technologies for tomorrow. Lee will provide an overview of existing smart packaging technologies that facilitate track and trace available in the market today, and demonstrate track and trace capabilities using NFC being developed by ThinFilm Electronics live on stage. The demonstration will show how to detect counterfeit or diverted product through the supply chain to the customer.
Tim Luong, CERADROP
Luong has been Sales Manager for the CERADROP Printed Electronics portion of MGI Group for the past six years, running primarily the Americas and Asia Pacific. Recently he was promoted to International Sales Manager for the Asia Pacific region. Formerly of FUJIFILM Dimatix, he was instrumental in launching inkjet systems and products in China and much of the Asia Pacific region. Luong will discuss the additive printing electronics process from pilot to manufacturing.
Robert Ramirez, FUJIFILM Dimatix
Ramirez is Chief Scientist leading the Materials Deposition group at FUJIFILM Dimatix in Santa Clara, CA. With a technical background in organic chemistry and materials science, his immediate goal is to help customers be successful in applying inkjet technology for advanced applications. He will speak about advances in components for inkjet materials printing, including how the FUJIFILM Dimatix Materials Printer (DMP)
Amir Sayegh, Geotab
Data Enablement Manager
Sayegh is a data enablement manager with the data and analytics team at Geotab, working with clients and partners to build out minimum viable products that use big data. Amir has a Ph.D. in Electrical and Computer Engineering from McMaster University. Sayegh will speak about the power of artificial intelligence and how it can help unlock the potential and value of the Internet of Things.
Chad Smithson, Xerox Research Centre of Canada
Chad Smithson joined the Xerox Research Centre of Canada (XRCC) as a research scientist for the printed electronics team in 2015. His role focuses on integrating printed and conventional electronics into hybrid technologies on a variety of unique substrates and unconventional form factors. He will speak about interactive smart retail displays utilizing hybrid printed electronics.
William Wong, University of Waterloo
Wong is a Professor at the University of Waterloo in the Department of Electrical and Computer Engineering. His current research focus is directed toward the development of thin film devices and novel nanocomposite materials for applications in high performance flexible electronics, solid state lighting, image sensors, and energy storage. He will speak about flexible electronics through heterogeneous integration of thin film and nanoscale materials.