Vahid Akhavan, NovaCentrix
Global Applications Engineering Lead
Akhavan is Global Applications Engineering Lead at NovaCentrix, based in Austin, Texas. He received his Ph.D. in Chemical Engineering from the University of Texas at Austin, and his research focuses strongly on colloidal synthesis, inorganic chemistry, and electronic device fabrication. Dr. Akhavan has over 17 peer reviewed publications, one patent application, and has presented at numerous technical seminars and workshops. He will discuss 2D large area and 3D printable electronics.
Alroy Almeida, Voltera
Almeida is CEO and co-founder of Voltera, a Canadian business working to bring rapid electronics fab to businesses and institutions around the world. Voltera focuses on early stages in the product development cycle as well as novel electronics applications. He will discuss the missing link in the printed electronics industry, along with insights on how to expand the adoption of printed electronics globally.
Ghada Badawy, McMaster University
Principal Research Engineer
Badawy is a Principal Research Engineer at the Computing Infrastructure Research Center (CIRC). She leads projects in resource allocation, capacity optimization, load balancing, network as a large system, energy-related issues and cross-layer design in wireless networks, wireless mesh, vehicular and sensor networks. She will speak about the ways in which we can identify and embrace disruptive innovation. She will discuss questions such as:
What is disruptive innovation? What are some examples of disruptive innovations? Are all innovations disruptive? And how should current businesses prepare for disruption in their markets?
Carl Blanchet, Cascades
Director of Corporate Innovation
Blanchet has played a key role in establishing innovation best practices at Cascades and since 2016 has been responsible for the company’s innovation centre. He’s a board member of the NSERC Green Electronics Network and a member of Montreal’s QG100 Network and R&D community of practice. Blanchet will speak about the rise of smart packaging and its implications on Cascades’ future innovations in packaging, hygiene and recovery solutions.
Chloé Bois, Insitut des communications graphiques et le imprimabilité (ICI)
Bois is R&D manager at ICI, where she specializes in advanced manufacturing, printed electronics applications, prototyping and developing methods to industrialize printed products manufactured by hybrid technologies such as graphic printing, printed electronics and embedded standard electronics. Bois will speak about updates to flexible road maps.
Gyoujin Cho, Sunchon National University
Professor, Department of Printed Electronics Engineering
Cho received a Ph.D. degree from the University of Oklahoma in 1995 and has focused his research on gravure printed electronics, successfully demonstrating R2R gravure printed NFC sensor labels and flexible digital signage for smart packaging for the first time. He will speak about anti-counterfeit technology for online shopping via mobile devices, using printed NFC activated cryptogram-labels interconnected with blockchain technology.
Justine Decaens, Groupe CTT Group
Decaens is a skilled engineering manager leveraging a strong technical background in R&D, quality control and laboratory testing. She works on R&D projects in technical textiles, smart textiles, advanced materials and protective clothing. She will speak about wearable tech and smart textiles as a platform for women’s leadership, especially compared to the traditional textiles industry, and how smart textiles can be a platform to merge traditional skills with new technologies and encourage women to get acquainted with such technologies.
Ali Dehghantanha, University of Guelph
Director, Cyber Science Lab
Dehghantanha is the director of Cyber Science Lab in the School of Computer Science, University of Guelph (UofG), Ontario, Canada. He will speak about the use of machine learning to protect the industrial Internet of Things from cyberattacks: While the IoT is already changing all aspects of our life, it mostly contains black boxes where customers have little to no insight about how IoT devices work or what they are capable of. This presentation offers a framework along with a technology stack to make a trustable IoT environment.
Colin Singh Dhillon, APMA
Dhillon is the Chief Technical Officer (CTO) at Canada’s Automotive Parts Manufacturer’s Association (APMA). He oversees the Autonomous Vehicle Innovation Network (AVIN) Demonstration Zone and provides support to the Canadian automotive industry on matters of Advanced Vehicle and Industry Technology. He will speak about 5G and C-V2X as the next chapter on the wireless communication front for automobiles. Which language will vehicles speak when they talk to one another? The connected vehicle is now capable of communicating with so much of its surroundings, the industry has labeled it as V2X (vehicle to everything).
Jay Fallah, NXM Labs
Fallah is a veteran technologist with extensive experience in developing innovative, leading edge software and hardware systems. He oversees all aspects of NXM’s Autonomous Security platform development and advanced research initiatives. He will discuss software designs that enable digital ledger technology (DLT) for near-field communications in the cloud, enabling metadata tracking associated with related devices and creating a security layer with the added agility of real-time data analytics. He will present an overview of the development and integration of this policy into NXM’s products to achieve advanced autonomous security and data integrity.
Denis Faubert, CARIC/CRIAQ
President & CEO
Faubert, who earned his Ph.D. in Laser Physics from Université Laval, is the President and CEO of both the Consortium for Aerospace Research and Innovation in Canada (CARIC) and the Consortium for Research and Innovation in Aerospace in Quebec (CRIAQ). Previously, he was the General Manager of the Hydro-Quebec Research Institute (IREQ). Faubert will speak about aerospace defence.
Sylvain Fournaise, Olymel
VP, Food Safety & Technical Services
Sylvain Fournaise joined Olymel in April 1998. He holds the position of Vice President, Food Safety and Technical Services. Since joining the company, he has orchestrated the development and implementation of corporate programs such as quality management and food safety, animal welfare, crisis management and business continuity, product traceability, biosecurity of facilities, SQF certification. He will speak about the challenges and opportunities when it comes to smart supply chains for fresh food.
Mario LeClerc, Université Laval/NSERC GreEN Network
Canada Research Chair
LeClerc is the Canada Research Chair on Electroactive and Photoactive Polymers at Laval’s Centre de Recherche en Sciences et Ingénierie des Macromolécules (CERSIM). He is also head of NSERC’s GreEN Electronics Network. He will speak about the current state and future potential of green electronics: the high throughput and low-cost manufacturing capabilities of printed electronics are ideally suited to the mass production of devices needed for the Internet of Things and smart packaging. But the potential scale of this mass production also presents an environmental challenge that must be addressed for PE manufacturing to be a viable approach.
Linh Le, Bonbouton
Le is a chemical engineer by training, he has published multiple papers, international conference proceedings and currently holds seven US patent. He later found Bonbouton, a technology platform for preventative diabetic healthcare. He will discuss Bonbouton’s product pipeline and recent collaborations with W.L. Gore and Liquid X Printed Metals to develop smart fabric for digital health applications.
James Lee, Jones Packaging
Since 2013, Lee has held the position of Director, Technology and Innovation at Jones Packaging, focusing on innovative packaging manufacturing and design technologies for tomorrow. Lee will provide an overview of existing smart packaging technologies that facilitate track and trace available in the market today, and demonstrate track and trace capabilities using NFC being developed by ThinFilm Electronics live on stage. The demonstration will show how to detect counterfeit or diverted product through the supply chain to the customer.
Tim Luong, CERADROP
International Sales Manager, Asia-Pacific
Luong has been Sales Manager for the CERADROP Printed Electronics portion of MGI Group for the past six years, running primarily the Americas and Asia Pacific. Recently he was promoted to International Sales Manager for the Asia Pacific region. Formerly of FUJIFILM Dimatix, he was instrumental in launching inkjet systems and products in China and much of the Asia Pacific region. Luong will discuss the additive printing electronics process from pilot to manufacturing.
Robert Ramirez, FUJIFILM Dimatix
Ramirez is Chief Scientist leading the Materials Deposition group at FUJIFILM Dimatix in Santa Clara, CA. With a technical background in organic chemistry and materials science, his immediate goal is to help customers be successful in applying inkjet technology for advanced applications. He will speak about advances in components for inkjet materials printing, including how the FUJIFILM Dimatix Materials Printer (DMP) enables high-performance, micro-precision printing and deposition of traditional inks and nano-particle fluids on all types of surfaces, including flexible substrates.
Rahul Raut, MacDermid Alpha Electronics Solutions
Director, Strategy and Technology Acquisition
Raut is Director of Strategy and Technology Acquisition at MacDermid Alpha Electronics Solutions, where he leads the firm’s New Business Development (NBD) Program and the building and deployment of growth strategies. He will discuss the growing use of Flexible Hybrid Assemblies in emerging electronics, and will present the results of a comprehensive multi-year initiative covering low-temperature alloy development and solder paste chemistry development.
S. Manian Ramkumar, Sunray Scientific
Managing Partner & Technical Advisor
Ramkumar has over 20 years of experience in advanced electronics packaging research and education. He pioneered the application of novel ZTACH ACA for PCB level assembly. He will discuss how ZTACH ACA, an innovative z-axis anisotropic conductive adhesive (ACA) that cures at low temperatures and does not require pressure during the cure cycle, can be used for reliable attachment of flip-chip bare die and fine-pitch components to flexible substrates. Specific assembly applications and reliability results will be discussed
Louis Roy, Optel Group
Roy is an ambassador of corporate social responsibility and founder of OPTEL. A global leader in traceability systems, the company has more than 800 employees worldwide. A renowned entrepreneur, Louis Roy has won numerous awards including the EY Entrepreneur Of The Year Award for Canada in 2017. He will talk about how to achieve the “triple bottom line” of Profit-People-Planet.
Amir Sayegh, Geotab
Data Enablement Manager
Sayegh is a data enablement manager with the data and analytics team at Geotab, working with clients and partners to build out minimum viable products that use big data. Amir has a Ph.D. in Electrical and Computer Engineering from McMaster University. Sayegh will speak about the power of artificial intelligence and how it can help unlock the potential and value of the Internet of Things.
Chad Smithson, Xerox Research Centre of Canada
Smithson joined the Xerox Research Centre of Canada (XRCC) as a research scientist for the printed electronics team in 2015. His role focuses on integrating printed and conventional electronics into hybrid technologies on a variety of unique substrates and unconventional form factors. He will speak about interactive smart retail displays utilizing hybrid printed electronics.
Arjun Wadhwa, École de technologie supérieure
Wadhwa is a printed electronics application engineer with research and industrial experience in the US and Canada in aerospace, medical devices and consumer electronics. He has worked with several printing processes such as aerosol jet and ink jet printing towards designing and manufacturing complex multifunctional structures. He will speak about printed conformal structural health monitoring devices for aerospace applications.
William Wong, University of Waterloo
Wong is a Professor at the University of Waterloo in the Department of Electrical and Computer Engineering. His current research focus is directed toward the development of thin film devices and novel nanocomposite materials for applications in high performance flexible electronics, solid state lighting, image sensors, and energy storage. He will speak about flexible electronics through heterogeneous integration of thin film and nanoscale materials. The effect of mechanical strain on the electrical and optical characteristics of thin-film and nanowire devices will be discussed in the context of developing this technology for flexible display and solar cell applications.
Panel: Collaboration Between Industry and Academia
Martin Bolduc is Director of Advanced Technologies at Varitron.