OTTAWA—March 01 2018—intelliPACK, (https://intelliflex.org/intellipack/), a smart packaging innovation accelerator, has named two new co-chairs for its Leadership Council as it embarks on the next phase of its growth.

intelliPACK was co-founded by the intelliFLEX Innovation Alliance (https://intelliflex.org)  and PAC Packaging Consortium (www.PAC.ca)  and their Members. intelliPACK collaborates with supply chain stakeholders to create awareness, educate and facilitate the broad adoption of solutions for smart packaging and retail – an active or intelligent interactive packaging system that delivers benefits and added functionality to the value chain.

The intelliPACK Leadership Council (LC) launched two years ago, consisting of representatives from across the value chain, from packaging companies to technology developers and consumer brands looking to incorporate smart packaging into their product lines.

Christina Cvetan, Customer Packaging Global Capability, Unilever R&D at Unilever, and Jeffrey Moore, General Sales Manager at the Add Ink division of Atlantic Packaging, served as the LC’s co-chairs for the first two-year term.

Two familiar faces that have already contributed much to the LC as members and to the smart packaging industry in general have been named to succeed Cvetan and Moore for the next two-year term.

They are:

  • Mark Baldwin, President & Co-Founder TUKU: Baldwin co-founded TUKU after spending over a decade successfully innovating the retail digital flyer industry at Conversys, a company he founded in 1999. As President and CEO, he provides the vision, innovative thinking and client focus that will position TUKU as an international leader in contactless in-store marketing communications.
  • James Lee, Director, Technology and Innovation, Jones Packaging: Lee has more than 20 years’ experience in the graphic arts and prepress industry. He joined Jones Packaging in 2008 to manage the prepress art and structural design teams. Since 2013, he has held his current position where he focuses on innovative packaging manufacturing and design technologies for tomorrow.

“The success of the intelliPACK LC has been a team effort by thought leaders who realize the need to work together on the digital transformation challenges that now grip the entire packaging/retail ecosystem,” said Mark Majewski, President and CEO of intelliFLEX. “I thank Christina and Jeffrey for all their hard work to take the LC through its startup phase, with full confidence that we are in good hands with Mark and James.”

“We continue to grow the membership and influence of intelliPACK because more and more organizations understand that turning the humble package into a connected and interactive device is the key to the future,” said James Downham, President and CEO of PAC. “I look forward to another two exciting years of growth and innovation with our new co-chairs and all our LC members.”

Learn more about the role and business case for smart packaging adoption in the latest intelliPACK white paper, Digital transformation in the packaging/retail supply chain.

About intelliFLEX

To become a Member of intelliFLEX, please contact Mark Majewski, President and CEO, at pkallai@intelliflex.org or +1 613-505-4775, ext. 101.

Media inquiries can be directed to Leo Valiquette, Director of Programs, at lvaliquette@intelliflex.org or +1 613-505-4775 ext. 102.

About Us

intelliFLEX, a not-for-profit industry alliance, is a vital partner for accelerating the growth of the printable, flexible and hybrid electronics sector of more than 300 organizations across Canada. Our technologies add intelligence and connect ordinary objects to enable the Internet of Everything.

We unite our growing global membership to build an effective ecosystem of supply chains for flexible, 3D printable electronics, 2D large area printable electronics, wearable electronics, smart textiles and hybrid electronics including related semiconductors, integrated circuits and software.

Our programs accelerate the adoption of these innovations for Smart Packaging and Retail, Intelligent Buildings and Connected Homes, Aerospace and Defence, Automotive and Industrial Applications, Health and Wellness, Intelligent Documents and Wearables.

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