March 14, Electronics360: Researchers from the University of Barcelona have developed a bonding technique to build intelligent flexible hybrid circuits using an inkjet printer with silver nanoparticles ink.

The need for a fast yet reliable and cheap process for developing circuits that also helps to reduce the environmental impact of standard fabrication processes was the basis for the development of the bonding technique. Researchers chose nanoparticles of silver for the ink because it is widely available and easy to reproduce into stable ink. While silver itself is not cheap, the amount used in the process was low enough to keep costs of the technique down, researchers say.

Read the full article.

About Us

intelliFLEX, a not-for-profit industry alliance, is a vital partner for accelerating the growth of the printable, flexible and hybrid electronics sector of more than 300 organizations across Canada. Our technologies add intelligence and connect ordinary objects to enable the Internet of Everything.

We unite our growing global membership to build an effective ecosystem of supply chains for flexible, 3D printable electronics, 2D large area printable electronics, wearable electronics, smart textiles and hybrid electronics including related semiconductors, integrated circuits and software.

Our programs accelerate the adoption of these innovations for Smart Packaging and Retail, Intelligent Buildings and Connected Homes, Aerospace and Defence, Automotive and Industrial Applications, Health and Wellness, Intelligent Documents and Wearables.

© 2023 intelliFLEX Innovation Alliance | All rights reserved
Privacy Policy | Terms & Conditions