CPEIA member company Novacentrix and Intrinsiq Materials have teamed up to create a high-performance, low cost, copper-clad polyimide achieved without the use of adhesives or time-consuming sputtering.These printed electronic thin film substrates cannot be produced by traditional lamination processes and can be used to create fine lines for High Density Interconnects (HDI) for flexible circuit applications.
October 19 @ 10:00 am - 12:30 pm EDT
October 22 @ 9:30 am - 12:00 pm EDT
October 23 @ 8:30 am - 4:30 pm EDT
October 29 @ 10:00 am - 12:30 pm EDT
November 5 - November 7