Ultra-thin printed copper-clad polyimide using photonic sintering for HDI applications

CPEIA member company Novacentrix and Intrinsiq Materials have teamed up to  create a high-performance, low cost, copper-clad polyimide achieved without the use of adhesives or time-consuming sputtering.These printed electronic thin film substrates cannot be produced by traditional lamination processes and can be used to create fine lines for High Density Interconnects (HDI) for flexible circuit applications.

Read the full announcement.