intelliPACK One-Day Course: Smart Packaging for Managers

In partnership with PAC Packaging Consortium, we dive into the rapidly growing market for active and intelligent packaging (“smart packaging”) that is enabled by Flexible and Hybrid Electronics (FHE). While this course is non-technical, it will touch on the key...

Highlights from CPES 2017

May 31, Printed Electronics World: James Hayward from IDTechEx attended CPES2017 last week at Centennial College in Toronto. Check out his slide show recap of key speaker presentations and keynotes on topics smart packaging, structural and 3D electronics, IoT...