intelliFLEX Leadership Councils
Bringing together supply chain stakeholders
Through its vertical business networks – intelliPACK, intelliBUILD, intelliWEAR and intelliPART (coming in 2018) – intelliFLEX delivers programming that brings together effective supply chain stakeholders to create awareness, educate, and facilitate the broad adoption of solutions enabled by flexible or hybrid electronics for specific end use markets.
Leadership Councils take these vertical programs to a whole new level by giving industry leaders high-level engagements with their peers across the supply chain for unique market insights to accelerate their product development and sharpen their competitive advantage.
Leadership councils are created when there is sufficient interest from our Members and participants in one of our vertical business networks.
Current Leadership Councils:
- intelliPACK Leadership Council
- intelliWEAR Leadership Council (launching this fall)
Sector Development Leadership Council
This high-level meeting, held every one or two years, is a gathering of senior executives from across the intelliFLEX membership to articulate and address the challenges facing the flexible and hybrid electronics sector, from commercialization and manufacturing scale-up, to financing and talent acquisition.
Read the Strategic Directions report from our inaugural 2016 Sector Development Leadership Council meeting.
Future Leadership Councils:
Members Only Portal
Members receive access to exclusive content, member directory, forums, job postings, and special events.
New 1-day courses in printable, flexible, hybrid electronics
Geared toward potential technology users and developers who wish to learn more about what is possible with printable, flexible or wearable electronics and how to integrate into products for a range of industries.
May 16-17, 2019
Domaine Chateau Bromont, Québec
At CPES, industry-leading Canadian and international speakers will explore all facets of FHE during the fifth annual CPES including flexible, stretchable, and 2D/3D printable electronics; smart textiles and wearables; and flex-integrated circuit technologies, software