intelliFLEX Leadership Councils

Bringing together supply chain stakeholders

Through its vertical business networks – intelliPACK, intelliBUILD, intelliWEAR and intelliPART (coming in 2018) – intelliFLEX delivers programming that brings together effective supply chain stakeholders to create awareness, educate, and facilitate the broad adoption of solutions enabled by flexible or hybrid electronics for specific end use markets.

Leadership Councils take these vertical programs to a whole new level by giving industry leaders high-level engagements with their peers across the supply chain for unique market insights to accelerate their product development and sharpen their competitive advantage.

Leadership councils are created when there is sufficient interest from our Members and participants in one of our vertical business networks.

Current Leadership Councils:

  • intelliPACK Leadership Council
  • intelliWEAR Leadership Council (launching this fall)

Sector Development Leadership Council

This high-level meeting, held every one or two years, is a gathering of senior executives from across the intelliFLEX membership to articulate and address the challenges facing the flexible and hybrid electronics sector, from commercialization and manufacturing scale-up, to financing and talent acquisition.

Read the Strategic Directions report from our inaugural 2016 Sector Development Leadership Council meeting.

Future Leadership Councils:

  • intelliBUILD
  • intelliPART

About Us

intelliFLEX, a not-for-profit industry alliance, is a vital partner for accelerating the growth of the printable, flexible and hybrid electronics sector of more than 300 organizations across Canada. Our technologies add intelligence and connect ordinary objects to enable the Internet of Everything.

We unite our growing global membership to build an effective ecosystem of supply chains for flexible, 3D printable electronics, 2D large area printable electronics, wearable electronics, smart textiles and hybrid electronics including related semiconductors, integrated circuits and software.

Our programs accelerate the adoption of these innovations for Smart Packaging and Retail, Intelligent Buildings and Connected Homes, Aerospace and Defence, Automotive and Industrial Applications, Health and Wellness, Intelligent Documents and Wearables.

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