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intelliFLEX Innovation Alliance

March 2019

LOPEC (Large-area, Organic and Printed Electronics Convention)

March 19 - March 21
Messe München, Messegelände, 81823 München
Munich, Germany
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LOPEC (Large-area, Organic & Printed Electronics Convention) is the leading trade fair and one of the most important conferences in the world for the printed electronics industry. The event takes place at Messe München convention center. It is the leading global platform in the industry and provides support in every aspect of the industry, from application to research. It connects, inspires and puts ideas into practice. For today and tomorrow. This is the place where printed electronics come to life. Printed electronics…

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April 2019

intelliPACK Leadership Council Meeting

April 3 @ 1:00 pm - 3:00 pm EDT

The intelliPACK Leadership Council will be coming together to continue discussions on environmental, business and industry directions, all while networking with their peers. Free for intelliPACK program members. To join this leadership council, please contact Mark Majewski at mmajewski@intelliflex.org (program fee of $500 per year). Location TBD. There will be a conference line available.

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Printed Electronics Europe 2019 (IDTechEx)

April 10 - April 11
Estrel Berlin, Sonnenallee 225
Berlin, Germany
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Bringing end users and suppliers together with 2,500-plus attendees, 200-plus exhibitors and 250-plus presentations. Assessing end user requirements, the latest diverse technology capability and all the opportunities of printed, flexible and hybrid electronics. IntelliFLEX members receive a 30% discount off registration prices. Please contact intelliFLEX to receive a promo code. To use the code, go to www.PrintedElectronicsEurope.com/Registration19 add the product to the basket and at check-out enter the code in the “Promotional code” box and update the basket for it…

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intelliPACK workshop: Smart Packaging for Managers @ Graphics Canada

April 11 @ 1:00 pm - 2:30 pm EDT
Toronto International Centre, 6900 Airport Rd
Mississauga, Ontario L4V 1E8 Canada
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Smart Packaging for Managers – by intelliPACK, PAC and intelliFLEX  Turbocharge your Graphics Canada 2019 experience with this 1.5 hour workshop, jointly held by PAC, Packaging Consortium and intelliFLEX, exploring the world of smart packaging. This workshop is presented by Printable Electronics Basics (XRCC, Voltera, intelliFLEX) and Smart Packaging (Jones Packaging, Ahead of the Curve, XRCC). We'll dive into the rapidly growing market for active and intelligent packaging (also known as “smart packaging”) that’s enabled by flexible, hybrid and printable…

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Overview Workshop in Flexible, Hybrid and Printable Electronics (FHE) @ Graphics Canada

April 11 @ 2:30 pm - 4:00 pm EDT
Toronto International Centre, 6900 Airport Rd
Mississauga, Ontario L4V 1E8 Canada
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In this 90-minute workshop we review the supply chain for creating and integrating flexible, hybrid and printable electronics into your products and applications. We explore the technology, its applications, and where FHE-enabled products are already in the market or soon will be. This workshop is presented by Jones Packaging, Ahead of the Curve, and XRCC. FHE is the toolbox for building not just the Internet of Things, but the Internet of Everything. It enables the creation of: Smart business cards,…

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NGEN Supercluster Project Pitch Day

April 16
The Tannery, 151 Charles St W
Waterloo, Ontario N2G 1H6 Canada
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Next Generation Manufacturing Canada (NGEN) invites interested companies to its first Supercluster Project Pitch Day, April 16th 2019 at The Tannery in Kitchener-Waterloo. Companies with Supercluster project ideas and in need of partners will deliver short presentations, then be available afterward to discuss their plans. NGen welcomes any company with a potential Supercluster project they wish to pitch to contact us at ideas@ngen.ca. The Advanced Manufacturing Supercluster administers $190 million in federal funding for industry-led, collaborative projects. Information about whether…

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May 2019

CPES2019 – presented by intelliFLEX

May 16 - May 17
Domaine Chateau Bromont, 90 Rue de Stanstead
Bromont, Quebec J2L 1K6 Canada
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$270 – $795

Explore all facets of flexible and hybrid electronics (FHE), including flexible, 2D and 3D printable, wearable, stretchable, smart textiles and flex-integrated circuit technologies, software and applications at CPES2019. This year's event will be held at the Chateau Bromont hotel in the beautiful Eastern Townships area of Quebec. Visit the CPES2019 Site This is a growth opportunity for all electronics players, including the semiconductor industry, as they hit the limits of Moore’s Law for integrated circuits. With the past three events taking…

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June 2019

intelliPACK/PAC Smart Packaging Course

June 5 @ 8:00 am - 4:30 pm EDT
Toronto Congress Centre, 650 Dixon Road
Etobicoke, Ontario M9W 1J1 Canada
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In the Smart Packaging course, we dive into the rapidly growing market for active and intelligent packaging, enabled by Flexible and Hybrid Electronics (FHE). While this course is non-technical, it will touch on the key technologies involved for smart packaging. Today's consumer is in the retail driver's seat, empowered and informed like never before by digital and mobile technologies. Brands and companies from across the supply chain are being forced to invest in this digital transformation to remain relevant. Product…

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November 2019

Best Defence Conference

November 5 - November 6
London Convention Centre, 300 York St.
London, Ontario N6B 1P8 Canada
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One of Canada’s premier Defence & Advanced Manufacturing events, providing information on Canadian defence procurement and supply chain opportunities. We work hard to provide an intimate forum for networking that sets the stage for you to conduct business. Early bird registration ends Sept. 6, 2019. To nominate a company for the conference Technology Showcase, for sponsorship details, or other information please contact: Heather Pilot hpilot@pilothill.ca 519-851-9848 “I think that Best Defence has provided the best ROI of any promotional efforts we’ve…

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Printed Electronics USA (IDTechEx Show!)

November 20 - November 21
Santa Clara Convention Center, 5001 Great America Parkway
Santa Clara, CA 95054 United States
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Bringing end users and suppliers together with 3,500-plus attendees, 270-plus exhibitors, and 250-plus presentations. Assessing end user requirements, the latest diverse technology capability and all the opportunities of printed, flexible and hybrid electronics. IntelliFLEX members receive a 30% discount off registration prices. Please contact intelliFLEX to receive a promotion code. To use the code, go to www.PrintedElectronicsUSA.com/Registration19 add the product to the basket and at check-out enter the code in the “Promotional code” box and update the basket for it…

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