The International Conference on Flexible and Printed Electronics (ICFPE 2017) will highlight challenges, emerging processes and applications in printing process, materials and devices. It will cover a broad range of topics in this field and focus on novel processes, novel materials and devices, enabled or constrained particularly by the nature of printing processing. The call for papers is now open.

ICFPE 2017 will underpin the need for collaboration and cooperation of individuals from a wide range of professional backgrounds.This rich program will also provide all attendees with the opportunities to meet and interact with the leading scientists, researchers and colleagues as well as sponsors.

ICFPE 2017 is jointly being organized by the Korea Printed Electronics Association (KoPEA), with supports from Organic Electronics Association (OE-A), research groups in Japan, Taiwan and China. Many leading scientists and engineers invited from Asia, Europe, USA will present relevant and up-to-date overviews of the current development in this field.

Jeju Island is an exceptional location for the Conference. It is renowned as one of the new seven wonders of nature with the sparkling ocean and towering Halla Mountains providing a unique and spectacular setting. The ICFPE 2017 will be held at The Shilla Hotel which is widely recognized as a resort with an exotic atmosphere and the best facilities.

Visit the ICFPE 2017 website to learn more.

About Us

intelliFLEX, a not-for-profit industry alliance, is a vital partner for accelerating the growth of the printable, flexible and hybrid electronics sector of more than 300 organizations across Canada. Our technologies add intelligence and connect ordinary objects to enable the Internet of Everything.

We unite our growing global membership to build an effective ecosystem of supply chains for flexible, 3D printable electronics, 2D large area printable electronics, wearable electronics, smart textiles and hybrid electronics including related semiconductors, integrated circuits and software.

Our programs accelerate the adoption of these innovations for Smart Packaging and Retail, Intelligent Buildings and Connected Homes, Aerospace and Defence, Automotive and Industrial Applications, Health and Wellness, Intelligent Documents and Wearables.

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