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LOPEC (Large-area, Organic and Printed Electronics Convention)

March 19 - March 21

LOPEC (Large-area, Organic & Printed Electronics Convention) is the leading trade fair and one of the most important conferences in the world for the printed electronics industry. The event takes place at Messe München convention center. It is the leading global platform in the industry and provides support in every aspect of the industry, from application to research. It connects, inspires and puts ideas into practice. For today and tomorrow. This is the place where printed electronics come to life.

Printed electronics is a growing industry with a promising future. LOPEC’s success mirrors this development. The figures speak for themselves.

intelliFLEX is bringing a Canadian delegation of up to eleven Canadian intelliFLEX small- or medium-sized enterprise (SME) members. The event, which draws thousands of attendees from dozens of countries and is organized by the Organic Electronics Association (OEA), takes place in Munich, Germany from March 19 to 21, 2019.

The exhibition takes place March 20-21, while the conference takes place March 19-21.

Performance figures for LOPEC 2018:

  • 153 exhibitors from 21 countries
  • About 2,500 participants, over half of them international guests from a total of 51 countries
  • 188 conference presentations from 25 countries
  • 98 percent of participants feel that LOPEC’s importance is stable and / or growing

Details

Start:
March 19
End:
March 21
Event Category:
Website:
https://www.lopec.com/

Venue

Messe München
Messegelände, 81823 München
Munich, Germany
+ Google Map
Website:
https://messe-muenchen.de/de/

About Us

intelliFLEX, a not-for-profit industry alliance, is a vital partner for accelerating the growth of the printable, flexible and hybrid electronics sector of more than 300 organizations across Canada. Our technologies add intelligence and connect ordinary objects to enable the Internet of Everything.

We unite our growing global membership to build an effective ecosystem of supply chains for flexible, 3D printable electronics, 2D large area printable electronics, wearable electronics, smart textiles and hybrid electronics including related semiconductors, integrated circuits and software.

Our programs accelerate the adoption of these innovations for Smart Packaging and Retail, Intelligent Buildings and Connected Homes, Aerospace and Defence, Automotive and Industrial Applications, Health and Wellness, Intelligent Documents and Wearables.

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