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intelliPACK presents Smart Packaging & Printed Electronics Workshops @ Graphics Canada Expo!

April 6, 2017 - April 8, 2017

  • Network with almost 9,000 industry professionals from across Canada and the U.S.
  • Explore new equipment and innovative products and services from 200 industry suppliers.

Graphics Canada Expo, Canada’s largest showcase for the graphic communications and printing industries, takes place April 6-8, 2017, at Toronto’s International Centre.

Under their joint intelliPACK Business Network, the CPEIA and PAC, Packaging Consortium are organizing two workshops as part of the Expo’s agenda – Smart Packaging and Printed Electronics. We also have a joint pavilion to exhibit for our Members.

Leading brand owners and technology experts will share intelligent and smart packaging systems. Applications will span wine and spirits, food and beverage, luxury, health and beauty, apparel, pharmaceuticals and other high value-added products. The focus will be on technologies and applications that extent shelf life, monitor freshness, enhance display information, improve safety and security, and increase convenience.

This is a great opportunity to expand your network and land new customers. If you are interested in speaking, exhibiting or attending either workshop, please contact Mark Majewski at pkallai@cpeia-acei.ca

Smart Packaging & Interactive Displays

Thursday, April 6th, 2017, 9 am -12 noon

Leading brand owners and technology experts will share intelligent and smart packaging systems and solutions. Applications for wine & spirits, electronics, foods and beverages, luxury, health & beauty, apparel, pharmaceuticals and other high value-added products. Products that help extend shelf life, monitor freshness, display information, improve safety, security and convenience.

1. Smart Packaging & Interactive Displays – Facilitator Jim Downham, PAC

Printable Electronics for Smart Packaging & Interactive Displays

Friday, April 7th, 2017, 9 am – 12 noon

Leading technical and manufacturing professionals will provide an overview of technology and equipment for smart packaging and building blocks with a technical and manufacturing focus. Printing and packaging companies will share intelligent and smart packaging systems that help protect brands and create new revenue generation for the company.

2. Printable Electronics for Smart Packaging & Interactive Displays – Facilitator Mark Majewski, CPEIA

  • Introduction  9:00 – 9:05 am – Mark Majewski, CPEIA
  • Presentation 1:  9:05 – 9:35 am   What is printable electronics and why is it suitable for smart packaging?  What are the key trends? Mark Majewski, Canadian Printable Electronics Industry Association
  • Presentation 2:  9:35 – 10:05 am   What printing processes can be applied and what conductive inks may be utilized to create interactive packaging? Can this be added your printing lines? Derrick Hemmings, Sun Chemical
  • Presentation 3:  10:05 – 10:35 am   What are the key electronics components that can be printed or flexible that can be used for smart packaging? – James Lee, Jones Packaging
  • Break 10:35 – 10:50 am
  • Presentation 4:  10:50 – 11:20 am   What key intelligent packaging applications can be supported by Printable Electronics? Dr. Ye Tao, NRC

 

Register now at the early bird rate of $75/person/day or $135 for both days. Your registration includes the $20 show admission.
Discounted rate expires February 28th, 2017. Rate after this date is $99/day/person or $175 for both days.

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About Us

intelliFLEX, a not-for-profit industry alliance, is a vital partner for accelerating the growth of the printable, flexible and hybrid electronics sector of more than 300 organizations across Canada. Our technologies add intelligence and connect ordinary objects to enable the Internet of Everything.

We unite our growing global membership to build an effective ecosystem of supply chains for flexible, 3D printable electronics, 2D large area printable electronics, wearable electronics, smart textiles and hybrid electronics including related semiconductors, integrated circuits and software.

Our programs accelerate the adoption of these innovations for Smart Packaging and Retail, Intelligent Buildings and Connected Homes, Aerospace and Defence, Automotive and Industrial Applications, Health and Wellness, Intelligent Documents and Wearables.

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