Dr. Melissa Grupen-Shemansky
CTO SEMI FlexTech
Dr. Grupen-Shemansky is the Chief Technology Officer at SEMI for flexible electronics and advanced packaging. She leads R&D consortia and the FlexTech governing and technical councils.
Melissa has over 25 years of experience in the semiconductor industry at various levels of management in research and development, manufacturing, business development, and technology strategy. She has worked at industry leading companies including Motorola, Semiconductor Products Sector, Lucent, Bell Labs, and AMD/Spansion. Prior to joining SEMI, Dr. Grupen-Shemansky was the Senior Vice President of Engineering for Advanced Nanotechnology Solutions, Inc, a startup in 3D ICs and cybersecurity.
Flexible Hybrid Electronics and the Roadmap to Printed Technology
A fascinating inflection point is emerging in the world of electronics. Gordon Moore’s observation that semiconductor transistor density was doubling every 2 years, and with that the chip performance, proved to be quite accurate for over 50 years. Moore’s “law” set the stage for long-term semiconductor strategy, cost efficiency, and research & development objectives. As the industry approaches 22 nm feature sizes and smaller, the pace slows, and perhaps approaches a limit to the linear shrink. Solutions are emerging in the 3rd dimension and SoC has an expanded definition from “system on a chip” to “system of chips.” This transition opens up new opportunities for investment and innovation in heterogeneous integration, system level solutions, interconnect, and unique data considerations to name just a few areas. Flexible hybrid electronics (FHE) is the fusion of the leading edge of semiconductor technology today with the versatility of additive printed electronics. The promise of lower cost and higher versatility of printed electronics is motivating R&D efforts. But, at present, printed cannot compete with the performance of traditional silicon devices. In this presentation, we will take a look at some leading edge FHE solutions and the roadmap to printed solutions as the industry invests in technologies beyond the silicon fab.
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