Learn, Connect, Partner, Profit at Canada’s top event for flexible and hybrid electronics

OTTAWA—February 22 2018—CPES2018 (https://intelliflex.org/cpes2018/), Canada’s premier conference and trade show exhibition for flexible and hybrid electronics (FHE), is assembling a world-class roster of session chairs, keynotes, panelists and subject matter experts to explore what’s new and what’s possible.

Organized by the intelliFLEX Innovation Alliance (www.intelliflex.org) CPES2018 takes place from May 23-24 at Centennial College’s Conference Centre in Toronto.

Some 2,000 companies are involved in the design, development or manufacturing of electronics-based products in Canada. They face increasing pressure to innovate and adapt in the face of stiff global competition. FHE offer fresh ways to grow revenue and compete with new products and applications for verticals like Smart Packaging and Retail, Intelligent Buildings and Connected Homes, Aerospace and Defence, Automotive and Aerospace, Health and Wellness, Intelligent Documents and Wearables.

CPES2018 is the place to learn about the materials, components, tools and manufacturing technologies and applications needed to capitalize on these opportunities.

“Whether your interests lie in the latest in materials science or in the practical considerations of commercializing new products and applications, we have you covered,” said Mark Majewski, CPES2018 co-chair and President and CEO of intelliFLEX. “We continue to expand the breadth of our agenda to explore where the latest market opportunities exist and how diverse players across the FHE ecosystem can work together to achieve great things.”

Here is a sampling of the 30+ innovators and thought leaders with whom you can engage through two days of keynotes, plenary sessions, panel discussions, startup pitch sessions and, of course, multiple networking opportunities:

Keynotes announced:

  • Melissa Grupen-Shemansky, CTO of FlexTech Alliance, the American industry association for the flexible and printed electronics industry supply chain. Grupen-Shemansky will deliver a keynote on the FHE Technology Road Map.
  • Christine DeFabio, Head of Global Connected Packaging Capability at Unilever. She will discuss in her keynote the consumer products giant’s journey from trial to large-scale implementation of FHE technologies.

Speakers announced:

  • Warren Ali, Director of Emerging Technologies Initiatives at APMA, Canada’s national association representing OEM producers for the worldwide automotive industry. He will serve as chair of our session where we explore FHE applications and market opportunities in automotive.
  • Simon Fried, President at Israel’s Nano Dimension, which researches and develops advanced 3D printed electronics, including a 3D printer for multilayer printed circuit boards. Fried will discuss revolutionizing printed circuit board manufacturing.
  • Rick Larson, Head of Technical Sales at Novacentrix. Our CPES2018 Diamond Sponsor is a leading product innovator in printable electronics manufacturing known for its Metalon conductive inks and PulseForge photonic curing tools. Larson will discuss scaling up from the lab to commercial production.
  • James Lee, Director of Technology Innovations for Smart Packaging at Jones Packaging. Jones is a pioneer in adding intelligence to packaging on high-speed production lines. Lee will moderate our industry panel, in which we discuss FHE applications and benefits for the smart packaging and retail supply chain.
  • Erika Rebrosova, Electronic Materials Technology Manager at Sun Chemical, the world’s largest producer of printing inks. Rebrosova will discuss material advances for in-mould electronics.
  • Brodie Stanfield, Founder and co-CEO of Inventing Future Technologies. This R&D hardware and software company has developed ARAIG, the world’s first multi-sensory and multi-directional force feedback suit. Stanfield will discuss the scale-up challenges facing wearables companies after getting funded by Manjit Minhas on Dragon’s Den a year ago.
  • Ilaria Varoli, Senior Vice-President at Myant. Myant made headlines last fall when it committed $100 million to the Advanced Manufacturing Supercluster proposal. Navdeep Bains, Canada’s Minister of Innovation, Science and Economic Development, named this Supercluster as one of the five winners last week. Varoli will chair our session on Smart Textiles and Wearables.

Industrial Design Workshop Leader

  • Dylan Horvath, President of Cortex Design, a product design and manufacturing firm in Toronto’s burgeoning art and design district. He will discuss industrial design best practices for electronics.

Evolving International Standards Workshop Leaders

  • Chris Jorgensen, Director Technology Transfer with IPC – Association Connecting Electronics Industries. This worldwide trade association represents the electronics interconnect industry. Jorgensen is staff liaison to standards development committees, including committees for e-textiles and printed electronics.
  • Haridoss Sarma, Research and Technology Scout and Go 2 Scout 4 R&T. A seasoned veteran in evaluating technology readiness levels and in technology transfer and commercialization. He and Jorgensen will discuss evolving new standards for FHE and how to incorporate these into your development processes for faster market access.

Intellectual Property Protection Workshop Leader

  • David Lotimer, MBM Intellectual Property Law, who works with entrepreneurs to support their businesses and to help them manage their IP assets. Lotimer will cover the critical steps in IP protection that many firms miss in their technology, product development and commercialization.

Get involved

Save $100 off the regular admission cost for CPES2018 if you register before March 31.

Visit CPES2018 today to register and learn more about sponsorship opportunities and to book a tabletop exhibit.

Contact Marie Bilodeau, Event Manager, at mbilodeau@intelliflex.org for more information.

About Us

intelliFLEX, a not-for-profit industry alliance, is a vital partner for accelerating the growth of the printable, flexible and hybrid electronics sector of more than 300 organizations across Canada. Our technologies add intelligence and connect ordinary objects to enable the Internet of Everything.

We unite our growing global membership to build an effective ecosystem of supply chains for flexible, 3D printable electronics, 2D large area printable electronics, wearable electronics, smart textiles and hybrid electronics including related semiconductors, integrated circuits and software.

Our programs accelerate the adoption of these innovations for Smart Packaging and Retail, Intelligent Buildings and Connected Homes, Aerospace and Defence, Automotive and Industrial Applications, Health and Wellness, Intelligent Documents and Wearables.

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