It’s time for a well-earned summer break

After another busy and rewarding year, we will take a well-earned break through July and August. Our team will continue to work behind the scenes on our programs and activities for the fall and winter, so stay tuned for fresh announcements after Labour Day and enjoy the sunny weather.

How GGI International has built a global business in custom human machine interface technologies

By Leo Valiquette

GGI International’s roots date back to the early 1900s in the product identification business, when Verne John Graham introduced one of the first pressure sensitive adhesive products to Canada. His son Bernard John Graham later joined him in the business.

GGI has evolved significantly over the years. Today, the company is managed by brothers and shareholders Peter and Ian Graham. They have strategically positioned GGI as a global leader in the design, engineering and manufacturing of custom human machine interface (HMI) technologies, where printed electronics components often play an integral role.

There isn’t that much of a stretch between the company his grandfather and father built and the GGI of today, says Peter Graham.

“A century ago, conventional product identification relied on adhesives activated by water,” Graham said. “The arrival of pressure sensitive adhesives was a disruptive new technology much like printed electronics are today.”
Read more about GGI International


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Is an RTO the right growth strategy for your business?

In May, Portugal’s YD Ynvisible, which develops proprietary electrochromic displays for smart labels, announced a reverse takeover (RTO) deal with defunct mineral exploration company Network Exploration Ltd. to acquire its public listing on the TSX Venture Exchange.

An RTO has proven to be an effective vehicle for many growth-stage Canadian technology firms to acquire a public listing without taking the costlier, more complex and prolonged route of a formal initial public offering. Initially, the private company buys enough shares to control a publicly traded company. The private company's shareholder then uses its shares in the private company to exchange for shares in the public company. At this point, the private company has effectively become a publicly traded company.

CIIRDF Launches New Call for Canada-Israel R&D Projects

The Canada-Israel Industrial R&D Foundation (CIIRDF) has launched a new Call for Proposals for bilateral R&D projects. Levering support from the governments of Canada and Israel, this CFP aims to stimulate R&D collaboration between firms in both countries with a focus on the commercialization of new technologies.

Funding: Following a rigorous evaluation process, CIIRDF selects and awards Canada-Israel R&D teams with financial contributions up to 50 per cent of the eligible project costs (a maximum of CDN$800,000 per project, whichever is less). Should the resulting innovation generate commercial revenues following project completion, CIIRDF funding is subject to repayment.

Eligibility: This CFP invites proposals with a non-defence application in all technology sectors from Canadian for-profit companies that are registered and operate in Canada, and Israeli for-profit companies that are registered and operate in Israel.

Apply Now:  For information on CIIRDF sector priorities, application guidelines, process, templates and proposal evaluation, please visit: CIIRDF Information Handbook & CIIRDF Proposal Template.

Application Deadline: Tuesday, August 2, 2016.

For additional information, please contact:
Les Abelson, CIIRDF Israel:
Tomoko Nishino, CIIRDF Canada:

Career Opportunities with CPEIA members

Many of our members are actively hiring. For example:

an innovation hub for designing, developing and producing wearable technology, is seeking: 
  • Application Engineer - Printed Electronics
  • Firmware Engineer
  • Machine Learning and Algorithm Development
  • R&D Engineer - Printed Electronics
  • Screen Printing Operator - Printed Electronics
Learn more about applying at Myant.

OM Signal, committed to bringing personal wellness into our daily lives through wearable technology, is seeking an Embedded Systems Engineer, Product-Oriented Web Engineer, Site Reliability Engineer and Software Developers for various disciplines. Learn more.


IntelliPACK Use Case: NFC Authority forges new digital relationship between consumer and brand

It’s summer time, and that calls for a drink. But how do you chose? People tend to stick with what they know, be it wine, beer or other spirits.

So how does a label stand out and get noticed, especially if it’s a local craft label competing with big national brands? It’s a tough global market, with over 100,000 new wines, beers and spirits introduced every year.

Learn how CPEIA member company NFC Authority is forging a new digital relationship between customer and product with its powerful patent-pending printed product tags and near field communication technology.
Download Use Case Studies

CPEIA seeks compelling case studies – just like NFC Authority’s

Are you actively bringing to market products, technologies or applications with printable, flexible or wearable electronics?

We are looking to document and promote compelling stories related to product development and commercialization. We want stories where the product is near to, or in the market. Tell us what problems you are solving for end-users, how your solution is different and unique, what market traction you have already achieved.

We will showcase the best stories on the CPEIA site and consider opportunities where the case study could be placed with an industry publication.

We make the process as painless as possible. To get started, please contact Leo Valiquette at

Would you like to host a tour of your facility?

The CPEIA works with its Members to host tours that provide promotional opportunities for the host venue and give attendees exclusive access to a world-class facility. We want to create a networking forum for like-minded individuals to connect in a non-competitive, non-threatening and education environment.

This is done by educating specific audiences on aspects of the development, prototyping, integration and manufacturing of printable, flexible or wearable electronics products and applications, with inside looks at related companies, production facilities, place of use facilities (e.g. long-term care facility), R&D facilities, materials science labs and process development labs.

To learn more, download the CPEIA Facility Tour Guidelines, or contact Peter Kallai at


IDTechEx Show, Nov. 16-17, Santa Clara, CA

Grow your business at the world's largest end-user focused event on emerging technologies, from 3D printing and printable electronics, to energy harvesting and wearables – nine shows under one roof.

Register before July 1 and receive a 40 per cent attendee discount. One pass gives you discounted access to all these co-located shows. Learn more.

IEEE ANTEM 2016, July 10-13, Montreal

IEEE’s 17th International Symposium on Antenna Technology and Applied Electromagnetics (ANTEM) takes place July 10-13 in Montreal. As part of ANTEM, the CPEIA will lead a special half-day Session on Printable Electronics.

The CPEIA has begun working with IEEE to develop applications for printable, flexible and wearable electronics and help our members tap into IEEE’s global networks. Take advantage of this opportunity to learn about PE-based antennas and network with delegates from around the world.

Learn more about ANTEM. For more information on this special session, please contact Peter Kallai at

2016 PAC Conference, September 28-29, Niagara

What emerging packaging innovations and technologies will flourish in 2025? Internet of Things, omni-channel, big data, analytics, virtual, 3D, digital printing, smart, interactive, robotics, artificial intelligence, computer-aided design, drones, technical and biological nutrients, nanotechnology are all keywords that are now relevant to the packaging industry.

IntelliPACK, the joint program of PAC and CPEIA, will have two presentations on smart packaging to give CPEIA and PAC Members an update on intelliPACK’s progress to-date for increasing the adoption of the smart packaging in North America. 

Who should attend?

All stakeholders across the packaging value chain who are thought leaders, transformational champions, strategic thinkers, visionaries and futurists will be the first to sign up for this PAC TO THE FUTURE Conference.

Visit the PAC site to learn more.

Industry News

Memtronik Innovations leverages membrane switch expertise for printed electronics
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CPEIA in the News

CPEIA forms partnership with electronic engineering association

CPEIA, IEEE forge strategic partnership
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