Sept. 8, C2MI, a center of excellence for advanced packaging and microsystems in Bromont, Que., will add new equipment to allow for stealth dicing, a laser-based technique for cutting up silicon wafers, after acquiring a fully automatic DFL 7340 laser saw from Japan’s Disco Corp. The saw has several advantages including the fact that it uses a dry (as opposed to water-based) process, and its allowance of improvised exploitation of wafers. For more information on the service you can contact C2MI, the MiQro Innovation Collaboration Centre, at

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