Sept. 3, Solid State Technology: Brewer Science recently announced its latest products, which includes additions to the BrewerBOND group of temporary bonding materials and the first iteration of its BrewerBUILD line of thin spin-on packaging materials. The company’s latest BrewerBOND products can be combined to create the company’s first dual-layer system for temporary product wafer bonding and de-bonding. The company says its new BrewerBUILD product was specifically created for redistribution layer (RDL) first fan-out wafer-level packaging (FOWLP).
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